PCB production

Withus has a cooperative relationship with a leading domestic PCB manufacturer and provides a service that satisfies the highest quality by completing a specification review in advance by collaborating with the manufacturer from the design stage

PCB Type

  • Build Up Board

    Highly integrated and ultra-precision PCBs are manufactured and applied to the build-up method and laser drilling a Micro VIA Hole on RCC in accordance with the trend of small diameter, light weight, and thinness of electronic products

    • Layer

      4~12

    • Thickness

      0.44mm / 0.55mm

    • Min Hole Size

      0.10mm(Laser Drill)

    • Via type

      B~all stack

  • Multilayer

    Multilayer is a solution that solves the high multiplication and high directivity of printed circuit boards due to the need for rapid data transmission and high-speed processing due to the spread of wireless data systems and mobile communication. withus maintains a stable impedance and can be produced.

    • Layer

      ~60

    • Thickness

      0.4mm / 7.0mm

    • Trace Width/Space

      0.075mm/0.075mm

    • Min Hole Size

      0.20mm

    • Via type

      Tolerance 10%

  • COB

    It is a method of directly mounting the plate conductor pip on the printed circuit board, and it is connected to the circuit or land by wire bonding or tab, and the surface requires complete sealing by a molding technique.

    • Layer

      2~4

    • Thickness

      0.20mm

    • Trace Width/Space

      0.075mm/0.075mm

    • Min Hole Size

      0.30mm

  • Rigid Flexible

    A rigid Flexible PCB is a complex PCB in the form of a combination of a commonly used rigid self-layer PCB and a flexible PCB.
    Rigid Flexible PCB is possible to respond to the high functionality and miniaturization of portable electronic devices because It is possible a 3D circuit connection.

    • Layer

      1~ 6

    • Thickness

      0.80mm - 1.60mm

    • Trace Width/Space

      0.075mm/0.075mm

    • Min Hole Size

      0.25mm

SMT Production

Supported Board Size Supported Chip Size Reflow Manual Insertion
L600mm*w463mm to L50mm*w50mm Chip 0402mm or higher N2 검사
L810mm*w480mm to L50mm*w50mm Chip 0402mm or higher,
BGA Size(44.7mm*44.7mm*15mm)
Equipments
  • 01SCREEN PRINTER PROCESS
    Cream Solder spray on PCB using Metal Mask.
  • 02CHIP MOUNTER
    PROCESS
    Chip mount on PCB that a sprayed solder cream
  • 03VARIANT MOUNTER PROCESS
    Variant parts mount on PCB that a sprayed solder
  • 04N2 REFLOW PROCESS
    Combine a PCB with chips by solder cream using high temperature and N2

Parts Purchasing Service

  • 1. Large purchase quantity

    If you want a low unit price due to large purchase quantity.

  • 2. Turnkey purchase

    If you want to purchase a variety of items at once

  • 3. Production purchase

    If you want a fixed unit price and stable supply regardless of market price fluctuations

  • 4. One-stop purchase

    If you have difficulty purchasing parts or want a regular purchasing agent

  • 5. Urgent purchase

    If you want urgent purchases such as short delivery times and discontinued parts

  • 6. Comparison quote

    If you want a lower unit price than other suppliers