CAE (Computer Aided Engineering)

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    Reduce development cost and time

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    Minimize opportunity cost and loss cost

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    Provision of design guidelines through more than 15 years of simulation know-how Provide design guide through simulation know-how based on more than 15 years of experience

Advantages

Types of CAE Consulting

SIGNAL INTEGRITY
As the switching speed of ICs increases and signals are transmitted faster, many signal degradation problems occur on PCBs. Even in the low frequency band, serious problems are occurring.
Signal integrity analysis is to analyze these problems and provide fundamental solutions so that there are no problems with fast switching speed and signals.
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    Pre-SI simulation
    Signal Integrity problems can be solved or predicted by optimizing restrictive wiring and stack-up settings, clock optimization, precise signal topology, and termination before PCB fabrication.
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    Post-SI simulation
    Signal integrity and timing analysis can be performed on the board after placing wiring and components on a PCB board. In particular, DDRx Wizard can perform complete timing analysis including signal derating and output skew compensation for DDR, DDR2, DDR3, DDR4 and DDR5 interfaces.

    S-parameter extraction: Provides accuracy frequency domain simulation results of PCB patterns quickly.

POWER INTEGRITY
Power integrity analysis has become an essential design process for the stable operation of the system.
The IC's voltage is decreasing and current consumption is increasing, So it is more difficult to smoothly supply DC voltage and current and AC voltage and current. If accurate voltage and sufficient current cannot be supplied to the IC, the IC will behave abnormally. The Solution is to Reduce power noise, EMI, and malfunction probability of PCB through the Power Integrity Analysis.
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    Analysis Power/GND Impedance
    Power/Ground Impedance: Support the optimal design guide to lower the Impedance below the Target Impedance after checking the Power/GND Impedance in a specific device.
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    Analysis IR-Drop
    Analysis voltage drop occurs from the power source to the chip.
    Voltage differences will be caused because of Long wiring, small areas, or many elements on the PCB. If the voltage drops too much, the device will not operate normally.